History
Now - 2021
Proven Value and Leadership in the Next-Generation
AI Semiconductor Packaging Inspection & Repair Market
- 2026
-
PLP RDL (AOR) set to be launched
SSR-Ⅴ (AOR) set to be launched
Registered as a member of Semiconductor Equipment and Materials International (SEMI)
Completed construction and relocated to a new office building in Dongtan, Hwaseong
- 2025
-
Launched PLP RDL (AOI)
Launched InSmart Nano (AOI)
Obtained the 15th World-Class Product certification for AOI for semiconductor package substrates
Selected as Grade A Inno-Biz for the 7th time
Established a subsidiary in Vietnam
Established a subsidiary in Singapore
- 2024
-
Launched Via Hole-IV (AOI)
Launched WLP RDL (AOI)
Launched InSmart Extreme/Color (AOI)
Selected as a Youth-Friendly Small Giant for the 9th time
Certified as a Small Giant for the 8th time
Selected as an excellent environmental company
Achieved ISO 45001:2018 certification
Promoted the Taiwan regional office to branch status
- 2023
-
Launched InSmart Ultimate Variable Resolution (AOI)
Launched InSmart Extreme/HS (AOI)
Awarded the $70 Million Export Tower on Trade Day
Listed on KOSDAQ
Established the China regional office
- 2022
-
Launched GiDC (SW_AI)
Launched InSmart Extreme UV (AOI)
Launched DV-S/HR Ultimate (VRS)
Won the Digital Innovation Award (IT/HW category)
Certified as Excellent Taxpayer
- 2021
-
Selected as one of the Top 1000 National Representative Innovative Companies
Won the IR52 Jang Young-shil Award for automated optical PCB repair equipment
Established the Taiwan regional office